PI Polyimide SMT Reflow Label
Product Description
Polyimide label designed for SMT surface-mount processes, withstanding reflow oven peak temperatures of 235–250°C. Labels maintain barcode clarity and adhesion after lead-free reflow thermal shock, ensuring full traceability from board mounting to shipment.
Uses 25μm ultra-thin Kapton film that does not affect SMT placement accuracy. ESD anti-static version available to protect sensitive semiconductor components. Widely used in PCB tracking, IC package labeling, and electronic component lifecycle management.
Specifications
Use Cases
SMT reflow oven process tracking, PCB board barcode labeling, IC package tracking, semiconductor wafer identification, electronic component lifecycle management.
Standards / Certifications
Request Samples / Quote
Whatever special labels you need, we can customize production for you. Minimum 500 pieces.